Kinetics of copper electrodeposition in the presence of triethyl-benzyl ammonium chloride - Sorbonne Université Access content directly
Journal Articles Journal of Applied Electrochemistry Year : 2003

Kinetics of copper electrodeposition in the presence of triethyl-benzyl ammonium chloride

Abstract

Quasi-steady state hydrodynamic voltammetry at a rotating-disc electrode and electrochemical impedance spectroscopy were used to investigate the influence of triethyl-benzyl-ammonium (TEBA) chloride on the kinetics of copper electrodeposition from sulphate acidic electrolytes.

Dates and versions

hal-04212319 , version 1 (20-09-2023)

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S. Varvara, L. Muresan, I.C. Popescu, Georges Maurin. Kinetics of copper electrodeposition in the presence of triethyl-benzyl ammonium chloride. Journal of Applied Electrochemistry, 2003, 33 (8), pp.685-692. ⟨10.1023/A:1025069004355⟩. ⟨hal-04212319⟩
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