Formation of a Copper Oxide Layer as a Key Step in the Metallic Copper Deposition Mechanism
Résumé
This paper demonstrates the formation of a Cu(OH)1.5Cl0.5 layer as a key step in the metallic copper
electrodeposition mechanism in sulfate solutions. This layer is located surprisingly into the metal/solution
interface and not on the reaction substrate. The difficult to study metal/solution interface makes indispensable
the use of unconventional measurement techniques. In this way, a careful in situ study by means of acoustic
impedance techniques associated with gravimetric techniques allowed the growth of this layer during the
metallic copper electrodeposition process to be monitored, probably for the first time.